Taiwan’s semiconductor industry is facing a surge in cyber espionage, as hacker groups linked to China intensify efforts to breach its globally critical supply chain. According to cybersecurity firm Proofpoint, at least three separate groups have been identified targeting chipmakers, chemical suppliers, and investment analysts with increasingly sophisticated tactics since March 2025, signalling a shift in both scale and precision of digital infiltration.
These attacks are not merely disruptive; they are strategic. Tactics have included spoofed university email accounts, fraudulent investment presentations, and malware-laden PDFs, designed to extract intelligence from firms often overlooked in traditional risk frameworks. Roughly 15 to 20 organisations have been impacted, many of which were not previously considered primary targets, underscoring a broader vulnerability beyond front-line chip manufacturers.
This spike in digital aggression coincides with rising geopolitical friction. As Washington tightens export controls on advanced AI chip technology, state-aligned Chinese groups appear to be using cyber means to offset access gaps. Taiwan’s dominance in semiconductor fabrication, anchored by giants like TSMC and MediaTek, makes it a prime target in this new phase of tech-driven geopolitical rivalry.
For global tech stakeholders, this development marks a clear pivot: cyber risk is no longer limited to corporate firewalls and factory floors. Analysts, academic partners, and chemical suppliers are now part of the expanded threat perimeter. Groups such as “Amoeba,” which targeted firms in Taiwan’s upstream supply chain, reflect a systemic challenge that calls for sector-wide vigilance and collaboration.
In an industry already strained by supply chain bottlenecks and export barriers, this rise in cyber threats adds a new layer of complexity. Long-term resilience in the semiconductor ecosystem will depend not only on technological innovation, but on cybersecurity readiness embedded across every tier of the value chain.
